chain saw on a rope, also known as a diamond wire saw, refers to the use of an electroplating process or a combination of resins to secure a diamond abrasive to a wire. In the 1990s, in order to solve the problem of processing large-size silicon wafers, wire saw processing technology was used to cut silicon rods into pieces.
Early wire sawing techniques used bare metal wires and free abrasives. During the machining process, the abrasive was added to the wire between the wire and the workpiece to create a cutting action. This technology has been successfully used in the processing of silicon and silicon carbide.
In order to further shorten the processing time, as well as to process other hard materials and difficult-to-machine ceramics, the diamond abrasive is fixed to the metal wire in a certain manner, thereby producing a fixed diamond wire saw.
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