Multi-wire Cutting Machine

Multi-wire cutting is a new kind of cutting method which takes abrasive into semiconductor processing area to grind through high-speed reciprocating movement of wire, and cuts hard and brittle materials such as semiconductor into hundreds of sheets at one time. CNC Multi-wire Cutting Machine has gradually replaced the traditional internal circle cutting, and become the main way of silicon wafer cutting.

High-precision CNC multi-wire high-speed cutting machine tool based on the key technology of high-precision, high-speed and low-consumption cutting control can fully realize the high-precision, high-speed and low-loss cutting of semiconductor materials and various hard and brittle materials, filling the domestic blank; the achievement has a number of independent intellectual property rights, the overall technology has reached international advanced water. The tension control technology of cutting line, the synchronization technology of receiving and releasing motor and main motor are in the leading international level.

Silicon wafer is the main production material in semiconductor and photovoltaic field. Silicon wafer multi-wire cutting technology is the world's more advanced silicon wafer processing technology, it is different from the traditional blade saw blade, grinding wheel blade and other cutting methods, but also different from advanced laser cutting and internal circular cutting, its principle is through a high-speed movement of steel wire to drive the attachment of cutting edges on the wire to friction silicon rods. So as to achieve the cutting effect. In the whole process, the steel wire is guided by more than a dozen wire wheels, forming a wire mesh on the main line roller, and the workpiece to be processed is fed by the descent of the worktable. Compared with other technologies, silicon wafer multi-wire cutting technology has the advantages of high efficiency, high productivity and high precision. It is the most widely used silicon wafer cutting technology.



Multi-wire slicen (MWS) is an innovative process for cutting brittle and hard materials such as silicon ingots. In this process, the cutting line is wound on a guide shaft, hundreds of cutting can be carried out simultaneously, and hundreds of slices can be obtained.

MWS process can be further divided into two branches, one is the traditional and widely used cutting and polishing process, the other is a new cutting and grinding process. In the cutting and polishing process, the uncoated cutting line is used, and in the cutting process, the cutting line is coated with polishing fluid. The cutting and grinding process uses the cutting line with diamond coating to cut, which can obtain ideal cutting effect and greatly improve production efficiency.

Multi-wire slicen  can be used to cut brittle and hard materials, such as silicon ingots, in addition to cutting difficult materials. The process has the following advantages:

(1) high economic efficiency. It can cut hundreds of chips at a time.

(2) silicon ingot with diameter cutting to 300mm

(3) the depth of crystal defects is small.

(4) fewer geometric defects (TTV, bow, deviation, etc.)

(5) suitable for splitting hard or brittle materials.